发明名称 |
Chip device e.g. for communication technology such as mobile phone, uses integrated circuit to form power amplifier and matching circuit for input- or output-impedance matching |
摘要 |
A chip device has a chip (10) with an integrated circuit, a leadframe (12), which has a carrier zone (18) for the chip (10) and in which a conductor (22) is formed, which forms part of a matching circuit for the integrated circuit. An independent claim is included for a method for manufacturing a chip device. |
申请公布号 |
DE10334384(A1) |
申请公布日期 |
2005.04.28 |
申请号 |
DE2003134384 |
申请日期 |
2003.07.28 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
FORSTNER, HANS PETER;DAECHE, FRANK;LIPPERER, GEORG;WEBER, STEPHAN |
分类号 |
H01L21/48;H01L21/56;H01L21/68;H01L23/31;H01L23/495;H01L23/544;H01L23/66 |
主分类号 |
H01L21/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|