发明名称 |
Multilayered substrate for semiconductor device |
摘要 |
A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
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申请公布号 |
US2005087860(A1) |
申请公布日期 |
2005.04.28 |
申请号 |
US20040995384 |
申请日期 |
2004.11.24 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
NAKAMURA JYUNICHI;KODAIRA TADASHI;MATSUMOTO SHUNICHIRO;ARATANI HIRONARI;TABUCHI TAKANORI;CHINO TAKESHI |
分类号 |
H01L23/12;H01L23/06;H01L23/08;H01L23/498;H01L23/52;H05K1/02;H05K3/00;H05K3/20;H05K3/34;H05K3/46;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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