<p>A plating solution for electroless copper plating which is suitable for improving deposit film adhesion and with which an even deposit can be formed at low temperatures. The plating solution for electroless copper plating is characterized by containing a water-soluble nitrogenous polymer therein. The plating solution for electroless copper plating preferably further contains glyoxylic acid and a phosphinic acid as reducing agents. The water-soluble nitrogenous polymer preferably is polyacrylamide or polyethyleneimine each preferably having a weight-average molecular weight (Mw) of 100,000 or higher and an Mw/Mn of 10.0 or lower.</p>
