| 摘要 |
The invention relates to a microstructural component (5), especially a microstructured high-frequency component, comprising a base body (11) on which an especially planar conductor structure (17, 17', 17", 17" ) is partially arranged. A seal area (16) is also provided wherein the conductor structure (17, 17', 17", 17" ) is enclosed by the base body (11) and glass (19). The conductor structure (17, 17', 17", 17" ), which is enclosed by the glass (19), is primarily used as a hermetically sealed leadthrough for high-frequency electromagnetic waves from the inner chamber (21) of a capped component (12) or sensor element. |
