Organic optoelectronic device encapsulation package

摘要

The present invention relates to an encapsulated organic optoelectronic device which comprises a substrate, an organic optoelectronic device situated on the substrate, a sealing cap comprising a perimeter seal flange having an upper and a lower surface, the lower surface of the perimeter seal flange being bonded to the substrate and forming a hermetic seal around the optoelectronic device. The lower surface of the perimeter seal flange has a textured surface enabling stronger adhesion between the substrate and the sealing cap and providing greater resistance to the permeation of atmospheric moisture and oxygen.