发明名称 |
Photosensitive formulation for buffer coatings, film containing the photosensitive formulation, and method for fabricating electronics with the photosensitive formulation |
摘要 |
A photosensitive formulation for high-temperature-resistant photoresists is based on polyhydroxyamides. The photosensitive formulations display a much higher photosensitivity than the comparable formulations based on quinone azide photoactive components. After conversion to the polybenzoxazole, the novel formulations also display a lower dielectric constant than the quinone azide-based formulations. A film can be made by applying the photosensitive formulation to a wafer and then evaporating the solvent. A method for fabricating electronics and micorelectronics structures a wafer by using the film in photolithography.
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申请公布号 |
US6884567(B2) |
申请公布日期 |
2005.04.26 |
申请号 |
US20020244257 |
申请日期 |
2002.09.16 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
SEZI RECAI |
分类号 |
G03F7/004;G03F7/038;G03F7/039;(IPC1-7):G03F7/004 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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