SOLUTION FOR ACTIVATION OF DIELECTRIC SURFACE AND OBTAINING CONDUCTING LAYER THEREON

摘要

A solution for activation of a dielectric surface and obtaining a conducting layer thereon, containing, in g/l: copper salt 35-350, hypophosphorous acid salt 35-400, stabilizer 0.004-250. A method of preparation of dielectric surfaces before electrochemical metallization comprising their activation and creation of a conducting layer thereon by way of their treatment with a solution of the above composition and subsequent thermal treatment at a temperature of 30-350`C.