发明名称 |
Test circuit and multi-chip package type semiconductor device having the test circuit |
摘要 |
A MCP semiconductor device includes at least first and second chips, each of which has internal pads and an internal circuit, encapsulated by a sealing material together. The device further includes a test circuit. The test circuit connects each of the internal pads to one of the internal circuits under a normal operation mode of the device, and disconnect between them under a test mode.
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申请公布号 |
US6885094(B2) |
申请公布日期 |
2005.04.26 |
申请号 |
US20030747153 |
申请日期 |
2003.12.30 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
INOUE KAZUTOSHI;OHIE MITSUYA |
分类号 |
G01R31/28;G01R31/3185;G06F11/22;H01L21/822;H01L27/04;(IPC1-7):H01L23/02 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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