a contact structure for interconnecting multi-level wires and a method for forming the same,申请号KR20020083417-传众专利搜索

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法人/股东/高管

发明名称	a contact structure for interconnecting multi-level wires and a method for forming the same
摘要
申请公布号	KR100485181(B1)	申请公布日期	2005.04.22
申请号	KR20020083417	申请日期	2002.12.24
申请人		发明人
分类号	H01L21/768;(IPC1-7):H01L21/768	主分类号	H01L21/768
代理机构		代理人
主权项
地址

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