发明名称 LASER BONDING METHOD, LASER BONDING DEVICE, AND OPTICAL MODULE MADE BY USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To stably bond and firmly fix an optical component to a resin-made holder to make an optical module or the like even in the presence of comparatively large gap between their bonding portions. <P>SOLUTION: This bonding method comprises the steps of irradiating the bonding portion of a resin-made holder 2 or the like with a laser beam 9 to melt and foam a resin material, and then bonding the swollen portion formed thereby to an object to be bonded such as an optical component 3. Accordingly, since the bonding portion melted by the laser beam 9 is aggressively deformed toward the object to be bonded, stable bonding and fixation can be obtained even in the presence of a comparatively large gap between the portions to be bonded. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005104092(A) 申请公布日期 2005.04.21
申请号 JP20030343884 申请日期 2003.10.02
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKADA KAZUMASA;KITAMURA YOSHIAKI;TAKECHI YOHEI
分类号 B23K26/00;B23K26/32;B29C65/16 主分类号 B23K26/00
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