发明名称 |
LASER BONDING METHOD, LASER BONDING DEVICE, AND OPTICAL MODULE MADE BY USING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To stably bond and firmly fix an optical component to a resin-made holder to make an optical module or the like even in the presence of comparatively large gap between their bonding portions. <P>SOLUTION: This bonding method comprises the steps of irradiating the bonding portion of a resin-made holder 2 or the like with a laser beam 9 to melt and foam a resin material, and then bonding the swollen portion formed thereby to an object to be bonded such as an optical component 3. Accordingly, since the bonding portion melted by the laser beam 9 is aggressively deformed toward the object to be bonded, stable bonding and fixation can be obtained even in the presence of a comparatively large gap between the portions to be bonded. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005104092(A) |
申请公布日期 |
2005.04.21 |
申请号 |
JP20030343884 |
申请日期 |
2003.10.02 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TAKADA KAZUMASA;KITAMURA YOSHIAKI;TAKECHI YOHEI |
分类号 |
B23K26/00;B23K26/32;B29C65/16 |
主分类号 |
B23K26/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|