| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of detecting a defective machining area which is unrevealed on the face of a workpiece. <P>SOLUTION: The laser beam machining device is equipped with a chuck table 36 for holding the workpiece and a laser beam irradiation means 52. The device is further provided with a machining sound wave detecting means 7 which detects a machining sound wave generated through the irradiation of a laser beam to the workpiece from the laser beam irradiation means 52, and a control means 8 which discriminates whether the detection signal falls in a prescribed allowable range. Machining defects can be confirmed by detecting a machining sound wave and discriminating whether the machining sound wave is in the prescribed allowable range thereof, and the confirmation result can be utilized for re-machining or defect analysis to be performed effectively as the case may be. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
