| 摘要 |
PROBLEM TO BE SOLVED: To achieve the miniaturization of a modular component by using a plurality of mounting substrate on which a plurality of electronic components are mounted with simple configuration. SOLUTION: This modular component comprises a plurality of mounted components sandwiched between a first substrate 6a and a second substrate 6b. The modular component has at least two or more first reference mounted components 3a, out of a plurality of mounted component which are mounted on the first substrate 6a taller than other mounted components and as tall as the components, the second substrate 6b provided along the top surface of at least two or more first reference mounted components 3a, and a plurality of first resin pillars 1 for positioning and holding the first substrate 6a and the second substrate 6b, wherein the first substrate 6a and the second substrate 6b are electrically connected together via the first reference mounted component 3a. COPYRIGHT: (C)2005,JPO&NCIPI
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