| 摘要 |
In a semiconductor device, rewirings 3 for connecting a semiconductor chip 1 a, a semiconductor chip 1 b and external connecting terminals 4 with each other are formed on the semiconductor chip 1 a. An insulating resin 6 having opening portions in regions for forming the external connecting terminals 4 at peripheral portion of the semiconductor chip 1 a and another opening portions in another region for mounting the semiconductor chip 1 b at the central of the semiconductor chip 1 a is overlaid on the rewirings 3 . The external connecting terminals 4 consisting of BGA are formed in the opening portions of the regions for forming the external connecting terminals 4 through lands 5 . The semiconductor chip 1 b is connected to another opening portions of another region for mounting the semiconductor chip 1 b by flip-chip structure through electrodes 11 and bumps 8 . A junction surface of the bumps 8 is sealed by a sealing resin 7 . The semiconductor chip 1 b is mounted on the same surface as that the external connecting terminals 4 are formed. The under surface of the semiconductor chip 1 b is ground in order that the semiconductor chip 1 b may be shorter than the external connecting terminals 4 . The semiconductor chip 1 b is thereby mounted with high density.
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