| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-type electronic component which does not generate any failure in the heat treatment for diffusing solder, such as generation of a hole in the nickel-plated layer and solder- or tin-plated layer and spattering of solder and is suitable for mass-productive system. SOLUTION: The chip-type electronic component is provided with a substrate 11 and an end surface electrode layer 15 provided to the end surface of the substrate 11. The end surface electrode layer 15 is constituted with a mixed material of conductive particles, nonconducting inorganic filler and a resin. Moreover, as the conductive particles, the mixed powder including carbon, whisker type inorganic filler covered with a conductive film at the surface thereof or whisker type carbon is used. In addition, as the resin, the epoxy resin is used. COPYRIGHT: (C)2005,JPO&NCIPI
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