发明名称 Plasma processing method, plasma etching method and manufacturing method of solid-state image sensor
摘要 A method of plasma processing is offered to suppress generation of interface states, specifically to suppress increase in the dark current of a solid-state image sensor by reducing the interface states. An interlayer insulation film made of silicon nitride film is formed over a silicon substrate by plasma CVD, and a photoresist layer is selectively formed on the interlayer insulation film. Subsequent heating process makes a profile of the photoresist layer round. Next, the interlayer insulation film is plasma-etched using the photoresist layer as a mask and a fluorocarbon gas as an etching gas to form micro lenses. Pulse-time-modulated plasma method in which RF power is supplied intermittently is used to suppress increase in the interface states at silicon-silicon dioxide interface due to an influence of UV light generated in the plasma etching.
申请公布号 US2005085087(A1) 申请公布日期 2005.04.21
申请号 US20040924263 申请日期 2004.08.24
申请人 SEIJI SAMUKAWA 发明人 OKIGAWA MITSURU;SAMUKAWA SEIJI
分类号 H01L27/14;H01L21/00;H01L21/302;H01L21/3065;H01L21/311;H01L21/461;H01L21/84;H01L27/148;H05H1/00;(IPC1-7):H01L21/00 主分类号 H01L27/14
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