| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser chip which enables reduction in size of package even when the laser beam is radiated in the a plurality of directions from a package, also to provide a semiconductor laser device mounting the same semiconductor laser chip and a lamp for lighting mounting the same semiconductor laser device. SOLUTION: The semiconductor laser chip 1A has the shape of a quadrangular prism including an active layer 11. The chip end surfaces 12a to 12d of the four surfaces perpendicular to the active layer 11 are formed in the mirror-surface structures. An electrode pattern 15 on the chip surface is formed in the shape of a cross along the radiating direction of the laser beam to bridge over the end from another end of the upper surface of chip, so that the laser beam can be radiated in the four directions from these chip end surfaces 12a to 12d. COPYRIGHT: (C)2005,JPO&NCIPI
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