发明名称 MOISTURE-CURING RESIN COMPOSITION AND ITS CURING METHOD
摘要 PROBLEM TO BE SOLVED: To solve the following problem: since the curing of an adhesive, a sealing material, or the like of a moisture-curing type proceeds by sucking internal moisture, moisture of an adherend, external moisture, or the like, the curing time becomes long when the adherend is a nonporous material containing no water, such as a metal or a tile, and a deep part does not cure when the coating thickness is thick. SOLUTION: The moisture-curing resin composition is prepared by compounding a modified silicone polymer having alkoxysilyl groups at its terminals with a curing catalyst and zeolite and can be cured quickly by expelling water adsorbed in zeolite to the outside by microwave induction heating or high-frequency induction heating. Therefore, even when the adherend is a nonporous one containing no water or even when the coating thickness is thick, the composition can be quickly cured, enabling work such as adhesion or sealing to be quickly done. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005105017(A) 申请公布日期 2005.04.21
申请号 JP20030336745 申请日期 2003.09.29
申请人 AICA KOGYO CO LTD 发明人 YAMADA SHINICHI;YANAGI TAKU
分类号 C08L83/04;C08K3/34;C08K5/098;(IPC1-7):C08L83/04 主分类号 C08L83/04
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