ULTRASONIC BONDING EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide an ultrasonic bonding equipment capable of ultrasonic bonding for a long electronic part in stable bonding quality. SOLUTION: In an ultrasonic bonding equipment for bonding an electronic part 4 of long profile to a substrate by load and ultrasonic vibration, a bonding portion 9 which is in abutting contact with the upper surface of this electronic part 4 in the long side direction of the electronic part 4 is arranged on the lower surface of a bonding tool 8 equipped with an ultrasonic vibrator 10 in a direction perpendicular to an axis line direction of the bonding tool 8, the bonding portion 9 is made to protrude over both sides of the direction of the long side of the electronic part 4, and the ultrasonic vibrator 10 is driven to give ultrasonic vibration in the direction perpendicular to the long side. Uniform ultrasonic vibration is transmitted to the electronic part 4 to secure stable bonding quality. COPYRIGHT: (C)2005,JPO&NCIPI