| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing a semiconductor device capable of providing a desired film thickness with less error. SOLUTION: There are provided a first measuring process for acquiring a first weight M1 by measuring the weight of a semiconductor substrate, a process for forming a process, a second measuring process for acquiring a second weight M2 by measuring the weight of the semiconductor substrate where the device is formed along with a tool for removing a part of the semiconductor substrate, and a third measuring process for acquiring a third weight M3 by removing a part of the semiconductor substrate from the rear surface of a device formation surface, and measuring the weight of the semiconductor substrate where the device is formed along with the tool for removing a part of the semiconductor substrate. By repeating the removal of a part of the semiconductor substrate and the third measuring process, a difference between the second weight and the first weight and a value of the third weight subtracted by the weight difference are monitored, to remove the semiconductor substrate down to a prescribed thickness t. COPYRIGHT: (C)2005,JPO&NCIPI
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