发明名称 SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To grasp accurately a captured state of a reaction secondary product or the like of acquisition means, judge proper maintenance time, and prevent faults such as flow passage blocking or the like during a treatment. SOLUTION: The semiconductor manufacturing apparatus comprises a reaction chamber 1 for processing a substrate 11, an exhaust pipe 12 for discharging exhaust gas from the reaction chamber, a pressure control mechanism 14 which is installed in the exhaust pipe and maintains pressure of the reaction chamber to a predetermined value, an acquisition means 15 which is installed in downstream of the pressure control mechanism and catches the reaction secondary product or the like in the exhaust gas, and pressure detectors 19, 20 which are installed at least one of the upstream and the downstream of the acquisition means in the downstream of the pressure control mechanism. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005108932(A) 申请公布日期 2005.04.21
申请号 JP20030336949 申请日期 2003.09.29
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 SANO ATSUSHI
分类号 C23C16/44;H01L21/205;H01L21/22;H01L21/3065;H01L21/324;(IPC1-7):H01L21/205;H01L21/306 主分类号 C23C16/44
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