发明名称 |
PROCESS FOR CREATING HOLES IN POLYMERIC SUBSTRATES |
摘要 |
Provided is a process for creating a via through a substrate including the steps of (a) providing a substantially void-free film of a curable composition; (b) applying a resist onto the curable film; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the curable film; (e) removing the exposed areas of the curable film to form holes through the curable film; and (f) heating the curable film of step (e) to a temperature and for a time sufficient to cure the curable composition. Also disclosed is a process of fabricating a circuit assembly which includes building patterned circuit layers upon a substrate that has vias provided by the aformentioned process. |
申请公布号 |
EP1523868(A1) |
申请公布日期 |
2005.04.20 |
申请号 |
EP20030739352 |
申请日期 |
2003.06.27 |
申请人 |
PPG INDUSTRIES OHIO, INC. |
发明人 |
OLSON, KEVIN, C.;WANG, ALAN, E. |
分类号 |
H05K3/42;H05K3/00;H05K3/46;(IPC1-7):H05K3/00 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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