| 发明名称 |
Adhesive composition with increased cure rate |
| 摘要 |
Adhesive composition consisting of an aminoplast resin with a free formaldehyde-like compound being present. In particular an adhesive composition consisting of a melamine-urea-formaldehyde resin to which a free formaldehyde-like compound has been added so that F/(NH<SUB>2</SUB>)<SUB>2 </SUB>is equal to 0.8-1.6. The adhesive is in particular suitable for the preparation of board material by combining in a press cellulose-containing materials with the adhesive according to the invention and in this press manufacturing board material at elevated temperature and pressure.
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| 申请公布号 |
US6881817(B2) |
申请公布日期 |
2005.04.19 |
| 申请号 |
US20020222963 |
申请日期 |
2002.08.19 |
| 申请人 |
DSM IP ASSETS B.V. |
发明人 |
VAN DER WAALS ADRIAAN CORNELIS LAMBERTUS MARIA;OOSTING GERARD EVERT;MATTHEIJ JOZEF MARIA JOHANNES |
| 分类号 |
C08G12/26;C08L61/30;C09J161/30;(IPC1-7):C08G12/32;C08G14/04 |
主分类号 |
C08G12/26 |
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