| 摘要 |
<p>An electronic component that is provided with leads at a narrow pitch that are plated with solder is packaged by soldering the leads to lands (14) on a printed circuit board on which the lands (14) have been formed in a pattern of arrangement that corresponds to said leads. When packaging, solder paste (11) is printed over areas on the lands (14) that are greater in area than the area of the lands (14). The leads are then placed on this solder paste (11), and the solder paste (11) is subjected to reflow to solder the leads onto the lands (14). <IMAGE></p> |
