SUBSTRATE PROCESSING APPARATUS

摘要

A semiconductor workpiece processing apparatus (10) having a first chamber (18), a transport vehicle (22), and another chamber. The first chamber (18) is capable of being isolated from an outside atmosphere. The transport vehicle (22) is located in the first chamber (18) and is movably supported from the first chamber (18) for moving linearly relative to the first chamber (18). The transport vehicle (22) includes a base (22C), and an integral semiconductor workpiece transfer arm (22A) movably mounted to the base (22C) and capable of multi- access movement relative to the base (22C). The other chamber (20) is communicably connected to the first chamber (18) via a closable opening (180) of the first chamber (18). The opening is sized to allow the transport vehicle (22) to transit between the first chamber (18) and the other chamber (20) through the opening.