LEAD FRAME FOR SEMICONDUCTOR DEVICE AND ENCAPSULATION MOLD FOR IT AS WELL AS ENCAPSULATION METHOD,申请号KR20030070849-传众专利搜索

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发明名称	LEAD FRAME FOR SEMICONDUCTOR DEVICE AND ENCAPSULATION MOLD FOR IT AS WELL AS ENCAPSULATION METHOD
摘要
申请公布号	KR20050035022(A)	申请公布日期	2005.04.15
申请号	KR20030070849	申请日期	2003.10.11
申请人	AMKOR TECHNOLOGY KOREA, INC.	发明人	HA, SUN HO;KIM, EUN DUK;KIM, KI HO;LEE, CHANG DEOK;SUNG, PIL JE
分类号	H01L21/56;H01L23/495;(IPC1-7):H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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