| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board, which is high in adhesiveness to an insulating layer and a wiring conductor layer and excellent in waterproof reliability whereby excellent in insulating property even when the microfabrication of the wiring conductor layer is effected. SOLUTION: In the wiring substrate comprising the insulating layer 2 formed on the surface of a core substrate 1 and the wiring conductor layer 3 adhered to the surface of the insulating layer 2, the insulating layer 2 is constituted of a thermosetting resin wherein thiol compound is connected to a group at the terminal end of a radical polymer. COPYRIGHT: (C)2005,JPO&NCIPI
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