| 摘要 |
PROBLEM TO BE SOLVED: To uniformly extend a sheet to which a semiconductor is adhered. SOLUTION: The sheet extending device is provided with: a sheet holding mechanism 21 to hold the outer periphery of a sheet 7 to which a semiconductor chip 17 is adhered; a heater block 11 made of a highly thermally-conductive material to be heated by a heater 22; an outer peripheral block 19 made of a highly thermally-conductive material that is arranged around the outer periphery of the heater block 11 with an air layer 23 in between; and an elevation mechanism 14 to elevate the heater block 11 and the outer peripheral block 19. COPYRIGHT: (C)2005,JPO&NCIPI |
