| 摘要 |
PROBLEM TO BE SOLVED: To provide an airtight sealing structure of a component which can be obtained by a comparatively simple manufacturing method, and a method of manufacturing it. SOLUTION: The method (100) of manufacturing a plurality of airtightly sealed electronic components comprises a step (102) of wafer-bonding first and second base plates and sealing the plurality of components between them, a step (104) of exposing first sealing on the first base plate and second sealing on the second base plate zoning outer peripheries of the plurality of components by cutting the first base plate, a step (106) of discharging solder into a cut-off part in the first base plate, and a step (108) of jointing a corresponding pair of the first and second sealings by reflowing the solder. COPYRIGHT: (C)2005,JPO&NCIPI |
