| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser machining method which can cut the object accurately even when the object to be machined contains various lamination structures. <P>SOLUTION: In the method, a protecting tape 25 is provided on the surface 3 of a wafer 1a, there is provided a melt-treating area 13 by multiphoton absorption by irradiating laser ray L with focusing the ray to the light-collecting point P to the inner part of a substrate 15 with using a back surface 21 of the wafer 1a as an incident surface of the laser ray, a starting area 8 for cutting is formed by the melt-treating area 13 in the inner site at the predetermined distance from the incident surface of a laser ray along a cutting line 5 of the wafer 1a, an expand tape 23 is provided on the back surface 21 of the wafer 1a, and plural chip parts 24 produced by cutting the wafer 1a starting from the starting area 8 for cutting are separated from one another by stretching the expand tape 23. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
