发明名称 ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component which keeps a package arranged so that a functional part of an electronic component element is sealed, having a single electrode in which a second electrode layer made of Ag is overlaid on a first electrode layer made of Ni or an Ni alloy, and which can effectively suppress the occurrence of an Ag whisker and can realize its miniaturization. SOLUTION: In the electronic component 1, a piezoelectric element 11 and a capacitor element 10 as electronic components are mounted on an insulating substrate 1, electrodes of the piezoelectric element 11 and the capacitor element 10 have a structure in which a second electrode layer made of Ag is laminated directly on a first electrode layer made of Ni or an Ni alloy, a metallic cap 19 as a second case material is bonded to the substrate 2 with an insulating adhesive 20, and the capacitor element 10 and the piezoelectric element 11 are sealed. The insulating adhesive 20 contains glycidyl amine epoxy resin of 10 wt% in full resin. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005101523(A) 申请公布日期 2005.04.14
申请号 JP20040174140 申请日期 2004.06.11
申请人 MURATA MFG CO LTD 发明人 TERABAYASHI TOYOHIRO;OSHIMA SHIGEO;OSHIRO MUNEYUKI;MORITA KOJI;NOMURA AKIHIRO
分类号 H01L23/10;H03H9/02;(IPC1-7):H01L23/10 主分类号 H01L23/10
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