| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for efficiently dividing a sapphire wafer by grinding and lapping the rear surface of a sapphire wafer, processing the wafer in a dry etching step, then scribing the wafer. <P>SOLUTION: The method for dividing semiconductor elements manufactured using a sapphire wafer as a substrate into chips includes a step (A) of grinding the rear surface of the sapphire wafer to have a predetermined thickness, a step (B) of lapping the ground rear surface of the sapphire wafer to have a predetermined thickness, a step (C) of dry etching the lapped rear surface of the sapphire wafer uniformly to have a predetermined thickness, and a step (D) of scribing the dry-etched rear surface of the sapphire wafer. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
