发明名称 HOTMELT COMPOSITION
摘要 PROBLEM TO BE SOLVED: To solve the problem that although hotmelt adhesives are widely used in various applications, those hotmelt adhesives which adhere to polyolefin-based resin materials, have an appropriate debonding feature from bonded state and leave a small compression set when compressed under heat have not been developed. SOLUTION: The hotmelt composition is obtained by mixing a hydrogenated paraffin-based process oil, a high molecular styrenic block polymer, a polyphenylene ether resin or a modified polyphenylene ether resin, an antioxidant and an amorphous polyalphaolefin. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005097360(A) 申请公布日期 2005.04.14
申请号 JP20030330368 申请日期 2003.09.22
申请人 AICA KOGYO CO LTD 发明人 IWATSUKA YUJI;NAKAMURA TOMOYA
分类号 C08L53/00;C08L71/12;C09J153/00;C09J171/12;(IPC1-7):C08L53/00 主分类号 C08L53/00
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