发明名称 METHOD FOR MANUFACTURING GROUP III NITRIDE WAFER
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a group III nitride wafer by which a substrate part and the group III nitride wafer can be uniformly separated. SOLUTION: The method for manufacturing the group III nitride wafer 20 comprises separating the wafer 1000 having the substrate part 10 in which an electroconductive group III nitride layer 30 is formed between the substrate part 10 and the group III nitride wafer 20 comprising at least one group III nitride layer, into the substrate part 10 and the group III nitride wafer 20 by decomposing the electroconductive group III nitride layer 30 by passing an electric current through the electroconductive group III nitride layer 30 in an electrolytic solution. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005097045(A) 申请公布日期 2005.04.14
申请号 JP20030333479 申请日期 2003.09.25
申请人 SUMITOMO ELECTRIC IND LTD 发明人 UEMATSU KOJI;ISHIBASHI KEIJI
分类号 C30B29/38;H01L21/306;(IPC1-7):C30B29/38 主分类号 C30B29/38
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