heat setting machine of semiconductor device manufacturing equipment and the fabricating method there of,申请号KR20020078602-传众专利搜索

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发明名称	heat setting machine of semiconductor device manufacturing equipment and the fabricating method there of
摘要
申请公布号	KR100482373(B1)	申请公布日期	2005.04.14
申请号	KR20020078602	申请日期	2002.12.11
申请人		发明人
分类号	H01L21/324;(IPC1-7):H01L21/324	主分类号	H01L21/324
代理机构		代理人
主权项
地址

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