| 摘要 |
PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a counter oscillating flow type heat transport device by contriving the arrangement structure of the headers of the counter oscillating flow type heat transport device. SOLUTION: A communication hole 2h is provided on the flat surface 2g of a tube and first and second headers 2d and 2e are arranged on the flat surface 2g. Thus, the arrangement structure and manufacturing (working) process of the first and second headers 2d and 2e are simplified, compared to the counter oscillating flow type heat transport device in which two header tanks requiring a relatively large volume are arranged on the end face on one end side in the longitudinal direction of a multi-hole tube, a first header tank part is communicated with odd-numbered flow paths and a second header tank part is communicated with even-numbered flow paths. The manufacturing cost of the counter oscillating flow type heat transport device 1 is reduced thereby. COPYRIGHT: (C)2005,JPO&NCIPI |
