发明名称 METHOD OF EVALUATING THICKNESS AND THICKNESS DISTRIBUTION OF THIN FILM
摘要 PROBLEM TO BE SOLVED: To provide a method for evaluating easily and quickly a film thickness and a distribution thereof of a thin film existing on a material surface, in particular, the method for evaluating the film thickness in a micro-part of the thin film existing on the material surface, and the film thickness distribution in a sample face. SOLUTION: In this method for evaluating the film thickness, an electron is emitted onto the evaluation-objective sample surface having the thin film of low-conductivity on a substrate, while changing an acceleration voltage serially, a secondary electron amount emitted from the evaluation-objective sample surface is measured to correspond to the acceleration voltage, and the thickness of the thin film is determined on the basis of the acceleration voltage varied in the secondary electron amount. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005098923(A) 申请公布日期 2005.04.14
申请号 JP20030335128 申请日期 2003.09.26
申请人 JFE STEEL KK 发明人 NAGOSHI MASAYASU;KONO TAKASHI;SATO KAORU;HAMADA ETSUO
分类号 G01B15/02;G01N23/225;H01L21/66;(IPC1-7):G01B15/02 主分类号 G01B15/02
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