| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a liquid jetting head which can greatly reduce manufacturing costs, and to provide a liquid jetting head. SOLUTION: There are set a process of forming a pair of piezoelectric element groups corresponding to a pair of pressure generating chamber arrays in the shape of a matrix at one face side of a passage formation substrate wafer; a process of joining a protecting substrate wafer with piezoelectric element holding parts and slit holes each provided at a region opposed to a gap between the pair of piezoelectric element groups and having a smaller width than that of a reservoir to the passage formation substrate wafer; a process of forming passages including the pressure generating chambers and communication parts formed at regions opposed to the slit holes into the passage formation substrate wafer; a process of cutting the passage formation substrate wafer and the protecting substrate wafer at predetermined regions including the slit holes and the regions opposed to the communication parts, thereby dividing the wafers to actuator chips with an array of piezoelectric element groups; a process of arranging a pair of the actuator chips by a predetermined interval to make the slit hole sides opposed to each other, and joining the chips to a nozzle plate; and a process of joining a side wall member to both side faces of the actuator chips, and blocking a gap between the pair of the actuator chips, thereby forming the reservoir. COPYRIGHT: (C)2005,JPO&NCIPI
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