| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To attach a minute IC chip to a desired place. <P>SOLUTION: The IC chip is attached by a process wherein a wafer and a plurality of dicing tapes (6, 7) are superposed and fixed onto a dicing surface plate (8) so as to expose the pattern surface of the wafer (5), a process wherein the dicing of wafer is effected in X-axis direction with a cutting depth arriving at the middle of the thickness of the dicing tape (6) for an upper layer, a process wherein the dicing of wafer is effected in Y-axis direction with a cutting depth arriving at the middle of the thickness of the dicing tape (7) for a lower layer, a process wherein the dicing tapes (6, 7) are peeled between the upper and lower layers to take out a belt type tape piece (6a) extended into Y-axis direction, and a process wherein the IC chip (4) on the tape piece is peeled off from the tape piece by pushing the tape piece against a predetermined attaching place from the back side of the same to bond the same. According to these processes, the minute IC chip (4) can be simply and correctly attached to the predetermined attaching place. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
