| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component by which a smaller electronic component is manufactured, and generation of malfunctions such as deformation and cracks of a conductive layer and a dielectric layer is effectively prevented. SOLUTION: The manufacturing method includes processes for: (A) coating a conductive pattern 9 is adhered to one main surface of a supporting film 6 with an adhesive agent 7; (B) selectively adhering a dielectric sheet 11 only to a portion in which the conductive pattern 9 does not exist on one main surface of the supporting film 6, by pressing the dielectric sheet 11 of nearly the same thickness as the conductive pattern 9 against both portions where the conductive pattern 9 exists and does not exist on the supporting film 6, from its one main surface side; (C) adhering the conductive pattern 9 and the dielectric sheet 11 on one main surface of the supporting film 6 are stripped from the supporting film 6 to form a laminated material by laminating a plurality of these; and (D) forming the electronic component burning the laminated material. COPYRIGHT: (C)2005,JPO&NCIPI
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