摘要 |
The present invention involves an optical sensor assembly (10, 100) including an optically transmissive substrate (12, 102) and an integrated circuit (16) having an optical imaging element (24). The optically transmissive substrate includes an integral filter element and the integrated circuit includes an optical imaging element which is located on a face (26) of the integrated circuit facing the substrate. The filter material may be dispersed, embedded, or otherwise formed within the substrate, or provided as a thin film layer (104) on a surface of the substrate. <IMAGE> |