THE CLEANING APPARATUS FOR WAFER AND THE CLEANING METHOD USING SAME

摘要

An apparatus and a method for cleaning a wafer are provided to prevent a charging damage and to stabilize the electrical characteristic of a wafer by minimizing a charge accumulation in a cleaning process using a linear motion unit at a spin chuck or at one side of a nozzle. A semiconductor substrate(W) is fixed by a rotatable spin chuck(30) having a motor(32). A cleaning solution is injected by a nozzle(40) of a scrubber from the top of the spin chuck. A linear motion unit(34,44) moves the spin chuck or the nozzle during an injection of the cleaning solution through the nozzle. The linear motion unit is installed at the lower side of the motor for the movement of the spin chuck, or at the one side of the nozzle for the movement of the nozzle.