发明名称 METHOD FOR MANUFACTURING SUBSTRATE CONJUGATE, SUBSTRATE CONJUGATE, METHOD FOR MANUFACTURING ELECTRO-OPTICAL APPARATUS, AND ELECTRO-OPTICAL APPARATUS
摘要 A method for manufacturing a substrate assembly, the substrate assembly, a method for manufacturing an electro-optical apparatus, and the electro-optical apparatus are provided to uniformly condense a filling resin into a gap between two substrates by uniformizing the gap between the two substrates. A substrate assembly is manufactured by bonding a first substrate(3) with a second substrate(4). The first substrate(3) includes first functional elements(13) thereon. The second substrate(4) includes second functional elements(21,25) thereon. A protective layer(30) is formed on at least one side of a side where the first functional elements(13) of the first substrate(3) is formed and a side where the second functional elements(21,25) of the second substrate(4) are formed. A surface of the protective layer(30) is planarized. An aperture is formed on the protective layer(30) at a position corresponding to a terminal portion which is electrically connected to the first functional elements(13) or the second functional elements(21,25). A conductor portion, for coupling the first functional elements(13) and the second functional elements(21,25) through the aperture, is formed on the terminal portion.
申请公布号 KR20050033488(A) 申请公布日期 2005.04.12
申请号 KR20040079410 申请日期 2004.10.06
申请人 SEIKO EPSON CORPORATION 发明人 KOEDA, HIROSHI;MAKIGAKI, TOMOHIRO
分类号 H05B33/04;B05D5/12;B32B3/00;G09F9/00;G09F9/30;H01L27/32;H01L29/78;H01L51/00;H01L51/40;H01L51/50;H01L51/52;H05B33/00;H05B33/10;H05B33/12;H05B33/14;H05B33/22 主分类号 H05B33/04
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