发明名称 |
METHOD FOR MANUFACTURING SUBSTRATE CONJUGATE, SUBSTRATE CONJUGATE, METHOD FOR MANUFACTURING ELECTRO-OPTICAL APPARATUS, AND ELECTRO-OPTICAL APPARATUS |
摘要 |
A method for manufacturing a substrate assembly, the substrate assembly, a method for manufacturing an electro-optical apparatus, and the electro-optical apparatus are provided to uniformly condense a filling resin into a gap between two substrates by uniformizing the gap between the two substrates. A substrate assembly is manufactured by bonding a first substrate(3) with a second substrate(4). The first substrate(3) includes first functional elements(13) thereon. The second substrate(4) includes second functional elements(21,25) thereon. A protective layer(30) is formed on at least one side of a side where the first functional elements(13) of the first substrate(3) is formed and a side where the second functional elements(21,25) of the second substrate(4) are formed. A surface of the protective layer(30) is planarized. An aperture is formed on the protective layer(30) at a position corresponding to a terminal portion which is electrically connected to the first functional elements(13) or the second functional elements(21,25). A conductor portion, for coupling the first functional elements(13) and the second functional elements(21,25) through the aperture, is formed on the terminal portion. |
申请公布号 |
KR20050033488(A) |
申请公布日期 |
2005.04.12 |
申请号 |
KR20040079410 |
申请日期 |
2004.10.06 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KOEDA, HIROSHI;MAKIGAKI, TOMOHIRO |
分类号 |
H05B33/04;B05D5/12;B32B3/00;G09F9/00;G09F9/30;H01L27/32;H01L29/78;H01L51/00;H01L51/40;H01L51/50;H01L51/52;H05B33/00;H05B33/10;H05B33/12;H05B33/14;H05B33/22 |
主分类号 |
H05B33/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|