| 摘要 |
PROBLEM TO BE SOLVED: To provide a joining method and a joining device of thin and weak optical substrates without damaging them and also in the state in which bubbles and interference fringes are not generated in adhered layers. SOLUTION: A joining method of optical substrates which joins two sheets of optical substrates 5, 6 through adhesives 14 has a 1st process (S4) of holding the optical substrates 5, 6 so that they are overlapped in the vertical direction through uncured adhesives 14 filled up in the gap 12 between the substrates, a 2nd process (S5) of expanding the adhesives 14 further by the weight of the substrate 5 by releasing the holding state to the substrate 5 which is held so as to be overlapped to the substrate 6 by the 1st process (S4) and a 3rd process of curing the adhesives 14 which is expanded further by the 2nd process (S5). COPYRIGHT: (C)2005,JPO&NCIPI
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