| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve adhesion strength between an electronic component device and a mother board. <P>SOLUTION: A mother board electrode 8 of a mother board 6 is connected to an external connection electrode 7 of a circuit board 2 in the electronic component device with solder 9. Further, a solder application portion 4 is provided on the surface of the periphery fixing portion 3 of a shield case 1 not in contact with the circuit board 2, so that the portion 4 can be soldered to a mother board grounding electrode 13 on the mother board 6, and the solder application portion 4 is connected to the mother board grounding electrode 13 with a module fixing solder connection portion 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
