| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for plating a small-sized electronic component where the deposition rate of plating is not reduced even for small components, the control in the dimensions of media or the like is easy, and adverse effects caused by the size reduction of media can be prevented. SOLUTION: In the method for plating a small-sized electronic component, the object to be treated and spherical media are charged into a barrel, the barrel is dipped into a plating liquid, and the object to be treated is subjected to plating treatment by stirring the object to be treated and the media by the rotation of the barrel and applying voltage via the plating liquid. When spherical media having a size larger than the dimensions in the longitudinal direction of the object to be treated are used, the rate of plating precipitation is not reduced, and the adverse effects caused by the size reduction of the media can be prevented. COPYRIGHT: (C)2005,JPO&NCIPI
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