| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having such an electrode extraction structure that can reduce an installation space and can improve mounting workability. <P>SOLUTION: An electrode plate 100 for extraction includes a horizontal portion 101 and a vertical portion 102. In a connecting part 103 on the bottom face side of the horizontal portion 101, the plate-like extraction electrode 100 is electrically connected with an emitter electrode Qe. On at least part of the surface except for the connecting part 103, a conductive film 90 is formed via an insulation film 80. The conductive film 90 formed on the surface of a contact 104 which is in contact with a gate electrode Qg via the insulation film 80 and the conductive film 90 is electrically joined to the gate electrode Qg. Without using wire bonding, electrical contact with the emitter electrode Qe and the gate electrode Qg of an upper arm element QU can be secured by a small space due to the integrally formed plate-like extraction electrode 100 and the conductive film 90. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
