| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition which is developed with water, achieves good pattern accuracy, ensures little residue of organic matter after baking by heating, and is used chiefly for a resistive element pattern excellent in adhesion, and also to provide a cured product thereof. <P>SOLUTION: The resin composition comprises a polymer (A) of a specified structure obtained using a compound of formula (1) (where R<SB>1</SB>is H or methyl; R<SB>2</SB>is H or alkyl; and n is an integer of 2-10) as starting material, a diluent (B), a photopolymerization initiator (C) and one or more kinds (D) selected from metal powder, a metal oxide, and glass. The cured product thereof is also provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
