| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To surely contrive the countermeasure for static electricity of a semiconductor chip by simplifying the mounting structure of the semiconductor chip and the attaching structure of the same. <P>SOLUTION: The semiconductor chip 23 is arranged on a circuit substrate 10 to connect the pad electrode 25 of the circuit substrate 10 to the bump electrode 24 of the semiconductor chip 23, then, a conductive member 26 is arranged on the upper surface of the semiconductor chip 23. A conductive connecting member 27 is arranged so as to ride over the upper surface of the semiconductor chip 23 to contact the central part 28 of connecting member 27 with the upper surface of the conductive member 26. Both ends 29 of the conductive connecting member 27 are inserted into the retaining holes 30 of the circuit substrate 10, whereby the conductive connecting member 27 is electrically connected to the reference potential of the circuit substrate 10. Accordingly, the mounting work of the conductive connecting member 27 can be facilitated and the conductive connecting member 27 can be electrically connected to the reference potential of the circuit substrate 10, whereby the mounting structure of the semiconductor chip 23 is simple and the countermeasure for the static electricity can surely be contrived. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
