| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent the breakdown and damage of a module structure which is constituted to absorb a difference in thermal expansions resulting from a temperature difference in a thermoelectric conversion module. SOLUTION: The thermoelectric conversion module 11 provided in a thermoelectric conversion apparatus comprises a pair of thermoelectric conversion elements 16, 17 formed of a p-type semiconductor 16 and an n-type semiconductor 17; a high temperature side electrode 18 and a low temperature side electrode 19 which are mounted to portions in contact with the system of the high temperature side 23 and a system of the low temperature side 24 of the thermoelectric conversion elements 16, 17; a high temperature side insulating substrate 12 for thermally connecting the high temperature side electrode 18 to the high temperature side system 23; a low temperature side insulating substrate 13 for thermally connecting the low temperature side electrode 19 to the system 24 of the low temperature side; and a surrounding frame 25 for accommodating and sealing therein the thermoelectric conversion elements 16, 17 and electrodes 18, 19. This surrounding frame 25 is joined to the low temperature side insulating substrate 13 as the module structure having a degree of freedom in the high temperature side. COPYRIGHT: (C)2005,JPO&NCIPI
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