发明名称 MANUFACTURING METHOD OF PUNCH DIE AND WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To reduce the arranging interval beetween punches of punch dies for forming opening parts in an insulating substrate. SOLUTION: This punch die includes: two or more punches; a punch plate having a support part for supporting the head parts of the punches; and a die having opening parts corresponding to the array of the punches. A second punch adjacent to a first punch is constructed so that the base of the head part is located rather closer to the cutting blade part side than the base of the head part of the first punch, and the distance from the base of the head part of the first punch to the base of the head part of the second punch is larger than the thickness of the head part of the first punch. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005088108(A) 申请公布日期 2005.04.07
申请号 JP20030323198 申请日期 2003.09.16
申请人 HITACHI CABLE LTD;SEKIGUCHI SEISAKUSHO:KK 发明人 OMORI TERUYUKI;YOSHIZAKI CHISATO
分类号 B26F1/14;H01L23/12;(IPC1-7):B26F1/14 主分类号 B26F1/14
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